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The degradation of Ultra Low K (ULK) SiCOH dielectrics before breakdown is investigated. For the first time very early stages of degradation before breakdown have been revealed and a model of the basic process of ULK alteration process under electrical stress is proposed. Two different degradation patterns were found. Tip electrode test structures have been specifically designed for this investigation...
This paper presents a basic investigation of Ultra Low K (ULK) SiCOH dielectrics degradation before breakdown. For the first time very early stages of degradation before breakdown have been revealed and a theory of the basic process of ULK alteration under electrical stress has been proposed. Tip electrode test structures have been specifically designed for this investigation in order to determine...
Debug and Diagnosis of Integrated Circuits with physical techniques is necessarily correlated strongly to the innovation of electronic device technology. Miniaturization and scaling were main reasons for the introduction of signal access through chip backside in recent years. The introduction of new materials is adding critical challenges, even on the active device level. Based on the technology roadmap...
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