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The chip-level 10-Gbit/s optical interconnects with the BER better than 10−12 using the 1 × 2 polymer vertical splitter, which is composed of a polymer waveguide and three silicon 45° reflectors is demonstrated.
A whole on-chip optical interconnects integrated with laser, photodetectors, driver IC, and amplifier IC is experimentally demonstrated. A 10-Gbps error-free data transmission is achieved as driving current of laser is 10 mA.
A polymer waveguide combined with three silicon 45° micro-reflectors is realized on a silicon substrate to form a 1 × 2 vertically optical splitter with a 20-Gbps transmission rate for on-chip optical interconnect application.
A guided-wave silicon optical bench with monolithic 45˚ micro-reflector for 3-D integrated optical interconnect is experimentally demonstrated. Optical coupling-efficiency between VCSEL and PIN PD is −1.74dB with 10mA bias, and detector current is 1.22mA.
A SOI-based three-dimensional vertically-splitting optical waveguides for optical interconnects is experimentally demonstrated first time. The optical insertion loss of −3.46 dB is experimentally obtained for the proposed splitter with tuneable splitting ratio from 4.9:1 to 1.2:1. Compared with the straight waveguide, the proposed waveguide have excess loss of 0.51 dB.
In this paper, we propose a 10-Gbit/s optical interconnect module realized on the silicon optical bench (SiOB) using the silicon-based 45° micro-reflectors terminated the polymer waveguides. The silicon-based 45° micro-reflectors are fabricated on an orientation-defined (100) silicon substrate by using anisotropic chemical wet etching. The VCSEL and PD chips are assembled at the input and output ports...
A three-dimensional on-chip optical interconnect with laser and photodetector is demonstrated using guided-wave silicon optical bench with 45-degree micro-reflector. Three-dimensional optical path is employed to connect laser and photodetector. The optical coupling efficiency between laser and photodetector is −1.74dB. 5-Gbps error-free data transmission with 6mA laser bias is measured.
A polymer waveguide monolithically integrated with three Si-based 45° reflectors realized on a Si substrate is proposed to form a 1 × 2 vertically optical splitter. A VCSEL chip at the input port and two PD chips at two output ports are flip-chip assembled on the proposed splitter to demonstrate the chip-level optical interconnects. The optical insertion loss of −4 dB with a splitting ratio of 1:1...
Miniaturized TOSA/ROSA by using silicon optical bench (SiOB) technology is experimentally demonstrated with parallel transmission of 4-channel×10-Gbps. Whole module assembly is passive alignment achievable, and no coupling lens needed.
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