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Shear behavior of Sn-3.0Ag-0.5Cu solder joints on ball grid array substrates was investigated with different solder volumes and shear speeds to study the solder volume effect on shear properties. Both solder volume and shear speed were found to have strong effect on the shear strength. The shear force decreases obviously with the decrease of the solder volume due to the significant decrease of loaded...
The bonding procedure of copper wire ball bonding on an aluminum-metallized silicon substrate was investigated in this paper. The four crucial parameters: ultrasonic power, impact force, frequency duration and bonding temperature were optimized. It was found that the process window was quite narrow, thus the bonding process was less stable. In conjunction with the results of the process optimization,...
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