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This paper reports construction of a new device to capture 3D point cloud on human body. The device consists of a horizontal LIDAR, a vertical LIDAR and pan rotational mechanism. The device contain three main features. 1) The device can capture point cloud in large area using combination of the vertical LIDAR and the rotational mechanism. 2) The device can measure dense point cloud using mirror reflection...
We have developed a compliant bump technology for 3D chip stacking with the same number of inter-chip connections as that in a VGA (video graphic array, 640 times 480). Using this technology together with a through-Si via (TSV) technology, we demonstrate a prototype of back-side illuminated CMOS image sensor, in which a very-thin rear-illuminated photodiode array is electrically connected to the CMOS...
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