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Thermal issues have become critical roadblocks for the development of advanced chip-multiprocessors (CMPs). In this paper, we introduce a new angle to view transient thermal analysis - based on predicting thermal profile, instead of calculating it. We develop a systematic framework that can learn different thermal profiles of a CMP by using an autoregressive (AR) model. The proposed AR model can serve...
Lifetime (long-term) reliability has been a main design challenge as technology scaling continues. Time-dependent dielectric breakdown (TDDB), negative bias temperature instability (NBTI), and electromigration (EM) are some of the critical failure mechanisms affecting lifetime reliability. Due to the correlation between different failure mechanisms and their significant dependence on the operating...
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