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In this paper, we model multiple vias with irregular antipad in arbitrarily shaped 3-D integrated circuit and packaging system based on generalized Foldy–Lax equations method, boundary integral equation method, and generalized T matrix. We first obtain the impedance matrix for finite cavity, which includes the reflection features of the cavity boundaries. Then, the scattered field from a single via...
This paper discusses a fast and accurate way to assess the impact of signal vias where the return current must change reference planes, including the effect of a return current via placed various distances from the signal via. The equivalent circuit includes capacitance of the via anti-pad as well as cavity effects.
Due to the increase in board density, routing traces on different layers becomes a widely used strategy. Through-hole vias are often used to connect these traces. Those vias that penetrate power/ground plane pairs could cause noise coupling between signal and power/ground nets. At the same time, the need for clean signal transmitted to receivers results in a wide use of differential signals. This...
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