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We used the molecular wafer bonding technique to develop a hybrid widely tunable, monomode III-V/Si laser for wavelength division multiplexing, with a tunability over 35 nm and an output power in excess of 3 mW.
Record transmissions with the direct modulation of a 1550nm-hybrid III/V-on-Silicon laser of 21.5Gbps in optical back-to-back (B2B) and 12.4Gbps over 50km of Single-Mode Fiber (SMF) are achieved. Neither optical amplification, nor optical dispersion-compensation is used.
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