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In this work, electrodeposited of Ni-W alloys were studied as barrier films between Cu substrate and lead free Sn3.8Ag0.7Cu (SAC387) solder. Wetting angle and spreading rate of SAC387 on Ni-W alloys with different tungsten contents were investigated and compared with that on Ni film deposited from Watt's bath. Ni-W alloy films of about 1.5 to 2.5 ??m were deposited from ammonia-citrate bath on copper...
Three aluminium metal matrix composites containing reinforcing particles of B 4 C, SiC and Al 2 O 3 (0-20vol.%) were processed. The stir-casting manufacturing route followed by hot extrusion was utilized, being one of the cost-effective industrial methods. A clear interfacial reaction product/layer was found at Al-SiC interface for composites held for a relatively long processing...
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