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The fabrication of near eutectic Sn-Bi alloy can be developed by reflowing a metal stack containing layers of Sn and Bi films. The Sn and Bi metal films are sequentially electroplated using two separate plating baths. Composition control of Sn-Bi alloy can be achieved by manipulating the thickness of constituent metal films. The thickness ratio of Sn to Bi is targeted to be approximately 0.97 to obtain...
In this research, the effects of Mn nanoparticles on wettability and interfacial intermetallic compounds in between Sn-3.8Ag-0.7Cu (SAC) solder and copper (Cu) substrate was investigated. The nanocomposite solders were fabricated by mechanical mixing of SAC solder paste with Mn nanoparticles. The melting characteristic of the solders was characterized by differential scanning calorimeter (DSC). The...
In this work, electrodeposited of Ni-W alloys were studied as barrier films between Cu substrate and lead free Sn3.8Ag0.7Cu (SAC387) solder. Wetting angle and spreading rate of SAC387 on Ni-W alloys with different tungsten contents were investigated and compared with that on Ni film deposited from Watt's bath. Ni-W alloy films of about 1.5 to 2.5 ??m were deposited from ammonia-citrate bath on copper...
In electronic packaging, solder alloy is used to connect the electronic devices on the copper pad to switch on the functionality of those devices. When solid copper comes in contact with a liquid solder alloy, reaction takes place and intermetallic compound (IMC) layer forms at the solid-liquid interface. To reduce the diffusion of the substrate, the major issue is to slow down the interfacial reactions...
This paper investigates the growth of intermetallics in Sn-3.8Ag-0.7Cu (SAC) solder with and without Co nanoparticle reinforcement. Co reinforced composite was prepared by mechanically mixing 0.5 wt% and 1.5 wt% Co nanoparticles respectively into Sn-3.8Ag-0.7Cu solder paste. The formation and growth of the intermetallic compounds (IMC) at the solder joint interface were evaluated after thermal aging...
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