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In this work, electrodeposited of Ni-W alloys were studied as barrier films between Cu substrate and lead free Sn3.8Ag0.7Cu (SAC387) solder. Wetting angle and spreading rate of SAC387 on Ni-W alloys with different tungsten contents were investigated and compared with that on Ni film deposited from Watt's bath. Ni-W alloy films of about 1.5 to 2.5 ??m were deposited from ammonia-citrate bath on copper...
In electronic packaging, solder alloy is used to connect the electronic devices on the copper pad to switch on the functionality of those devices. When solid copper comes in contact with a liquid solder alloy, reaction takes place and intermetallic compound (IMC) layer forms at the solid-liquid interface. To reduce the diffusion of the substrate, the major issue is to slow down the interfacial reactions...
Environmental and health concerns have resulted in significant activities to find substitutes for lead-contained solders for microelectronics. The potential candidates such as Sn-Ag1 and Sn-Ag-Cu1 eutectic solders with melting temperatures of 221?C and 217?C, respectively are the most prominent solders because of their excellent mechanical properties as compared with that of eutectic Sn-Pb solder2...
This paper investigates the growth of intermetallics in Sn-3.8Ag-0.7Cu (SAC) solder with and without Co nanoparticle reinforcement. Co reinforced composite was prepared by mechanically mixing 0.5 wt% and 1.5 wt% Co nanoparticles respectively into Sn-3.8Ag-0.7Cu solder paste. The formation and growth of the intermetallic compounds (IMC) at the solder joint interface were evaluated after thermal aging...
RoHS Directive for environmental and health concerns have resulted in significant activities to find substitutes for lead-contained solders for microelectronics. The potential candidates such as Sn-Ag1 and Sn-Ag-Cu1 eutectic solders with melting temperatures of 221degC and 217degC, respectively are the most prominent solders because of their excellent mechanical properties as compared with that of...
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