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The fabrication of near eutectic Sn-Bi alloy can be developed by reflowing a metal stack containing layers of Sn and Bi films. The Sn and Bi metal films are sequentially electroplated using two separate plating baths. Composition control of Sn-Bi alloy can be achieved by manipulating the thickness of constituent metal films. The thickness ratio of Sn to Bi is targeted to be approximately 0.97 to obtain...
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