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Nanoengineered structures have received significant attention due to the application of porous media convection structures. Metal porous structures provide unique combinations of large surface to volume ratio, high conductivity, and mechanical compliance. The integration of metal porous structures can improve the performance of convective heat exchangers for high heat flux thermal management. Copper...
Copper inverse opal films offer an attractive combination of conduction and convection transport properties that yield a low total thermal resistance for microfluidic heat exchanger applications. In this work, we present an integrated synthesis and characterization strategy to fabricate nanoporous copper inverse opal films and to measure the effective thermal conductivity. We synthesize inverse opal...
Vertically aligned carbon nanotube (CNT) arrays can offer an attractive combination of high thermal conductance and mechanical compliance for thermal interface applications. These arrays require a reliable, thermally conductive bonding technique to enable integration into devices. This paper examines the use of a reactive metal bonding layer to attach and transfer CNT arrays to metal-coated substrates,...
Vertically aligned carbon nanotube (CNT) arrays can provide the required combination of high thermal conductivity and mechanical compliance for thermal interface applications. Much work in the last 15 years has focused on improving the quality and intrinsic thermal conductivity of the nanotube arrays. Currently the thermal interface resistance between nanotube arrays and surrounding materials limits...
The large temperature gradients experienced by thermoelectric modules induce significant thermal stresses which eventually lead to device failure. The impact of thermal cycling on a commercial thermoelectric module is investigated through characterization of the electrical properties. In this work, we measure the evolution of the thermoelectric and electrical properties with thermal cycling. One side...
Vertically-aligned carbon nanotube (CNT) films offer an attractive combination of properties for thermal interface applications, specifically high thermal conductance and mechanical compliance. In this work, we examine the use of a solder bonding layer to attach and transfer CNT films from the silicon growth substrate onto metalized surfaces. Indium foil is considered as a bonding layer for low-temperature...
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