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The «Through Silicon Vias» technology, developed for silicon interposer interconnects network, has inspired new capacitors components named «Through Silicon Capacitors (TSC)». Two architectures of TSC are studied in this paper: the Single Sided-TSC architecture where the TSC bodies are connected in parallel by the BEOL metal layers M1 and M2 and the Double Sided-TSC architecture where the TSC bodies...
Inspired from Through Silicon Vias (TSVs), Through Silicon Capacitors (TSCs) are newly developed capacitors integrated throughout the silicon interposer. This paper deals with a demonstrator which investigates the first process steps of TSCs. A predictive modeling method of the impedance of large matrices of such components is proposed. The modeling method makes use of 2D/3D parasitic extraction software...
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