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For the MMB delamination experiments on CU-EMC interfaces as previously discussed in [1-6], the interface fracture shows the characteristics of a "brittle interface". This is because of the fact that the actual fracture appears between the brittle EMC and the brittle CU-oxides (being present on the CU lead-frame). Low cycle fatigue fracture or sub-critical fracture under cyclic loading conditions...
In order to promote the professional education and meet the requirements for the well-qualified technicians of the microelectronics industry , the higher education division of the education ministry and Intel (China) jointly initiated and setup a new mode of higher professional education faculty training:ldquo2008 Microelectronics Manufacturing Engineering Faculty Training Camprdquo, of which the...
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