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Two enhanced high power LED thermal structures with LTCC (Low Temperature Cofired Ceramics) packaging are presented. At first, these two types of structures are introduced respectively in details. One is called structure GPC (Gold-plated Copper) and the other is called structure SPA (Silver-plated Aluminum). Later, thermal analyses are made by CFD software and the calculated-junction-temperature will...
With the progress of the lead-free in electronics industry, the reliability of SAC 305 lead-free solder joint is particularly important. According to typical components (BGA) suffering from thermal cycling and thermal aging test, present the fatigue life of the solder joint. Check the solder joint cracking at different cycling. Cross section and metallographic microscope are performed to inspect the...
The purpose of this work is to conduct the multi-physics simulation analysis of LED-based luminaires under certain temperature and humidity environment, and to find out the vulnerable spot of the luminaire. The coupled modeling of LED luminaire during step stress accelerated test (SSAT) is simulated by ANSYS. Five types of modeling, i.e. thermal and thermo-mechanical modeling, moisture diffusion and...
In this paper, some models of LED luminaires with drive power supply were established by Pro/Engineer. The temperature distribution of these models was obtained by ANSYS Workbench. And the influences of the location of drive power supply and surface areas of heat sinks were discussed. When drive power supply was located in different groove, the temperature of drive power supply was gradually reduced...
This paper presents the investigation for the electrical characterization of PMNT (lead magnesium niobate - lead titanate) thin-films with different fabrication parameters. The PMNT thin-films are processed under different conditions. Electrical characterization results including capacitance-voltage (C-V) measurements at different voltages and frequencies are presented.
Rf power amplifier (Radio frequency power amplifier) has an important role in the military field due to its unique advantage. However,the Rf power amplifier devices will produce a large quantity of heat when they are working. The heat for the influence of the device is bigger, so the strict thermal design needs to be used on its Rf Power amplifier packages.
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