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P-MOSFETs with HfO2 gate dielectric and TiN metal gate were fabricated on compressively strained SiGe layers with a Ge content of 50 at.% and electrically characterized. The devices showed good output and transfer characteristics. The hole mobility, extracted by a split C-V technique, presents a value of ~200 cm2/V·s in the strong inversion regime.
Integration of lanthanum lutetium oxide (LaLuO3) with a κ value of 30 is demonstrated on high mobility biaxially tensile strained Si (sSi) and compressively strained SiGe for fully depleted n/p-MOSFETs as a gate dielectric. N-MOSFETs on sSi fabricated with a full replacement gate process indicated very good electrical performance with steep subthreshold slopes of ~72 mV/dec and Ion/Ioff ratios up...
X-ray and Co-60 irradiations caused large differences in charge buildup in SOI buried oxides because of the various electron-hole charge yield and dose enhancement effects. Dose enhancement effects are monitored with standard SOI NMOS transistors by measuring back-gate threshold shifts due to oxide-trapped charge. We have demonstrated that the device response to X-ray radiation can be used to predict...
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