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This study proposed a method using Low-melting-point alloy (LMPA) to seal Micro heat pipes (MHPs), which were made of Si substrates and glass covers. Corresponding MHP structures with charging and sealing channels were designed. Three different auxiliary structures were investigated to study the sealability of MHPs with LMPA. One structure is rectangular and the others are triangular with corner angles...
Micro heat pipe (MHP) has been an ideal device for heat transfer. With its high thermal conductivity coefficient, high temperature uniformity, a lot of research groups have studied its performance. Some researches just connected it to a metal heating source to study how the MHP dissipated the heat; this procedure is simpler than connected to Light-emitting Diode (LED) chips. However, the thermal characteristics,...
High-power light emitting diode (LED) technology has developed rapidly in recent years because of the urgent need to reduce carbon emission. With the increasing illumination intensity of LEDs, thermal management became a critical issue in LED device design. Combining a heat pipe with a heat sink is a method in thermal management for high power LEDs. In this paper, an LED substrate integrated with...
Light-emitting diodes (LEDs) offer the electric lighting market a new and revolutionary light source that saves energy and improves light quality. With the increasing illumination intensity of LEDs, thermal management became a critical issue in its design. In this paper, an LED module integrated with a micro heat pipe and heat sink was designed and fabricated. Micro grooves were fabricated on the...
A novel perfusion method of micro heat pipe(MHP) is presented in this paper. The MHP has length of 26mm, width of 20 mm, and thickness of approximate 2.2mm. The predetermined quantity of perfusion is 25µl. Small volume and large capillary force render conventional vacuum perfusion methods quite impractical. In order to realize microscale and high precision of perfusion, the method of combining the...
One of the most critical issues in electronic industry is the thermal management of electronic devices, such as high-power light-emitting diodes (LEDs), high density integrated circuit(IC). Currently, the major limitation for the development of such devices is due to the lack of an efficient technique to remove heat in a narrow space. Micro heat pipes (MHPs) using MEMS technique can solve this problem...
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