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The 3-D network-on-chip (NoC) router is a major source of thermal hotspots, limiting the performance gain of 3-D integration. Due to the varying cooling efficiency of different silicon layers in 3-D NoC, the optimal criteria of traditional load balancing design (LBD) scheme and temperature balancing design (TBD) scheme may not be satisfied. To analyze the tradeoff between performance and temperature,...
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