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A series of monotonic and cyclic experiments, including constant strain-rate, creep and cyclic loading tests at isothermal temperatures between 25°C and 150°C, were performed to characterize the viscoplastic behavior of Pb-free Sn2.4Ag solder. The constitutive model of the solder was developed by fitting the monotonic test results to the Anand viscoplastic model. Finite element model based on the...
This study proposes a node-aware distributed simulation system for accelerating production simulation. To optimize simulation performance, this system proposes the performance-surveying module and the node-invoking module based on a MapReduce parallel framework to dynamically invoke valuable nodes during simulation. The performance-surveying module periodically records each node performance and ranks...
The time-independent plastic and time-dependent creep deformations of Sn3.8Ag0.7Cu solder are considered in a unified framework by using a state variable approach. A new viscoplastic constitutive model that includes the kinematic hardening behavior of solder is proposed in this paper. Back stress, which is used for characterizing the kinematic hardening behavior, is selected as the state variable...
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