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This paper presents a problem formulation and procedure for design automation of 2.5D interposer-based multi-die ICs. Our approach is designed for (but not limited to) 2.5D ICs that contain one or more dies with flexible I/Os — such as FPGA dies. Given a set of dies, inter-die connections, I/O standard(s) for the connections, and a set of valid die pins for the connections, we simultaneously place...
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