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Wiring inductance has a critical effect on electrical, thermal, and electromagnetic compatibility (EMC) performances in inverters. Therefore, the low stray inductance laminated busbar, as a state-of-the-art pathway interface, is widely used in high-power inverters. However, the asymmetrical stray inductances of the laminated busbar may cause different voltage and thermal stresses for semiconductor...
This paper focuses on the modeling and optimization of the laminated busbar used in high power inverters. First, through the circuit structure analysis, the commutation loops of the laminated busbar are analyzed in a single-phase H-bridge inverter; then, the commutation loops are modeled and simulated via the three-dimensional (3-D) finite element simulation, and unbalanced commutation loops' inductances...
For the low-middle voltage and high-current applications, the topology of the combined three-phase inverter is employed, and the mathematical model in the rotating coordinates (simply, the dq coordinates) is established. A novel dynamic strategy based on feed-forward compensation is put forward to enhance the speed of dynamic response in this paper. The shifting effects of supply voltage and output...
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