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In the present study, Sn0.3Ag0.7Cu spherical solders with diameter in the range of 10∼50 µm were assembled on the flux-coated Cu metallization and then reflowed at temperature of 250°C to form Sn0.3Ag0.7Cu/Cu micro-bump joints, and the size and boundary effects on the growth and morphology evolution of interfacial intermetallic compound (IMC) of micro-bump solder joints were studied. Results show...
To reduce the cost of soldering materials and alleviate the thermal shock of temperature-sensitive electronic components during board-level packaging process, SnBi(Ag) solder pastes were explored to replace SnAgCu solder pastes due to the feature of low melting temperature of SnBi(Ag) solders. In this study, Sn3.0Ag0.5Cu (SAC305) solder balls as IC pins were assembled with SnBi(Ag) solder pastes in...
The paper presents the design and implementation of input/output interface circuits, fully compatible with low-voltage differential signal (LVDS) standard. Due to the low voltage differential transmission technique, the low power consumption and high transmission speed are achieved at the same time. The transmitter is implemented by a closed-loop control circuit and an internal bandgap voltage reference,...
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