The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
A dry film photoresist was selected as the sacrificial material for a metal lift off process. However, a weak and inconsistent adhesion of the evaporated under bump metallurgy (UBM) and solder on the passivation surface was observed during the dry film stripping process. This problem may be due to the poor negative profile (88 to 89 degrees) of the patterned dry film side wall after dry film developing,...
In this paper, we have developed the evaluation results of low cure temperature (less than 200 deg C) dielectric materials in terms of process ability and adhesion on SiN and mold compound substrates. The results showed that the low cure temperature dielectric materials have good adhesion on SiN and mold compound substrate. Integration of thin film passives like inductors, capacitors and band pass...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.