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The cleanliness of Au, Cu and Sn surfaces by Ar fast atom beam (FAB) and Ar-plasma treatment was investigated using X-ray photoelectron spectroscopy (XPS). Oxides and organic residues can be removed and clean metal surfaces can be achieved using Ar-FAB activation. The vacuum background of Ar-plasma pretreatment influenced the cleanliness to metal surfaces. The influence of surface cleanliness was...
Three-dimensional packaging technology, which requires fine pitch and high density of solder bumps, has been developed recently for system-in-package applications. There are several methods being used for solder bumping process for now. As the sphere pitch decreases to below 100 mum, electrodepositing has an advantage over robotic ball placement and screen printing in the cost per ball, according...
This work reports on the wetting behavior of electrolyte in fine pitch Cu/Sn bumping process by electroplating. Three methods containing adding complex wetting agent to electrolyte, plasma treatment to photo-resist and ultrasonic vibration were taken to improve the wettability between electrolyte and related materials. Contact angles of electrolyte containing different amount of complex wetting agent...
We report on the contact process utilizing fritting phenomena between Al electrode and probes made of tin or tin gold alloy. The contact method with low contact force on Al electrodes is required for test probing of LSI for the next generation. The test probes made of tungsten or nickel are suitable for making contact with mechanical breaking of aluminum oxide. However, when these hard probes are...
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