The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
This paper focuses on heterogeneous integration technology and its application in optical displacement microsensor. The integration is based on the Au-Au surface-activated bonding at a relatively low bonding temperature of 150degC. Applying this technique, an ultra-compact and thin optical displacement microsensor with three-dimensional structure (2.8 mm times 2.8 mm times 1 mm thick) was fabricated...
We report successful bonding of photodiodes on glass substrate using Au stud bumps by Au-Au surface-activated bonding at a relatively low bonding temperature of 150degC. A glass substrate with the flip-chip bonded photodiode chips was then vertically stacked on a Si substrate with the bonded laser diode chip using Au-Au surface-activated bonding. Applying this technique, compact and thin optical microsensors...
Hybrid integration of multiple optical chips in three dimensions is an important technology for realizing highly functional, compact optoelectronic microsystems. In this paper, we report successful 3-D integration of optical chips performed using Au-Au surface-activated bonding (SAB) at a relatively low bonding temperature of 150degC. A glass substrate with the flip-chip-bonded photodiode chips was...
The hybrid integration of multiple chips in three dimensions is an important technology for realizing highly functional, compact optoelectronic microsystems. In this study, three-dimensional integration of optical chips was successfully performed using Au-Au surface-activated bonding (bonding temperature: 150degC). The fabricated microsystem consists of two elements: i) a micromachined silicon optical...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.