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93W and Mo1 were bonded with and without Cu interlayer by plasma activated sintering. The bonding temperature was decreased greatly with Cu interlayer. Shear strength of 93W/Cu foil/Mo1 and 93W/Cu film/Mo1 were 148.4MPa and 193.3MPa, respectively. Elements were fully diffused at 93W/Cu and Cu/Mo1 interfaces. Fe-Ni binder in 93W alloy has a sound diffusion with Cu interlayer, and Ni enriched in diffusion...
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