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Circuits designed in aggressively scaled technologies face both stringent power constraints and increased process variability. Achieving high parametric yield is a key design objective, but is complicated by the correlation between power and performance. This paper proposes a novel design time body bias selection framework for parametric yield optimization while reducing testing costs. The framework...
Gate oxide breakdown is a key factor limiting the useful lifetime of an integrated circuit. Unfortunately, the conventional approach for full chip oxide reliability analysis assumes a uniform oxide-thickness for all devices. In practice, however, gate-oxide thickness varies from die-to-die and within-die and as the precision of process control worsens an alternative reliability analysis approach is...
As technology is aggressively scaled, nano-regime VLSI designs are becoming increasingly susceptible to process variations. Unlike pre-silicon optimization, post-silicon techniques can tune the individual die to better meet the power-delay constraints. This paper proposes a variation-aware methodology for the simultaneous gate sizing and clustering for post-silicon tuning with adaptive body biasing...
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