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Electromagnetic problems with both conducting and dielectric media are formulated through volume-surface integral equations (VSIEs) in integral equation approach. The conducting part is described by surface integral equation while the dielectric part is governed by volume integral equations (VIEs) and they are coupled together by produced fields. The VSIEs are usually solved by the method of moments...
Solving electromagnetic (EM) scattering with very thin conducting objects by integral equation approach have to deal with some unfavorable problems, such as a large dynamic change of current density in the neighborhood of their edges and many low-quality meshes on the side faces of objects in geometric discretization, which makes the accurate evaluation of singular integrals in matrix elements significant...
Accurate electromagnetic (EM) analysis is performed for transmission line structures with finite-thickness conductors. Traditionally, the analysis ignores the thickness of conductors to simplify the model but such an ignorance may not be allowed in many applications. In this paper, a rigorous three-dimensional (3D) model without any geometric approximation is established and the method of moment (MoM)...
Lossy conductors are not perfectly electric conductors and their finite conductivity needs to be carefully accounted for in the accurate solution of electromagnetic problems. Traditionally, surface integral equations (SIEs) are used to approximately describe the problems, but we use volume integral equations (VIEs) to exactly formulate the problems by treating the lossy conductors as dielectric-like...
Accurate electromagnetic (EM) analysis for interconnect structures requires to consider the finite conductivity of involved conductors. The conductor loss could be accounted for through an approximate surface impedance when the skin depth of current is small. However, this approximation may not be valid for large skin depth caused by low frequencies or small conductivities. In this work, we treat...
Electromagnetic (EM) analysis for interconnect and packaging structures usually relies on the solutions of surface integral equations (SIEs) with an assumption of homogeneous substrates in integral equation solvers. In this work, we consider the inhomogeneity of substrates and replace the SIEs with the volume integral equations (VIEs) to form volume-surface integral equations (VSIEs) for the structures...
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