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NiSi is a promising material on salicide process. However, the thermal stability of NiSi is still a significant problem. Degradation in sheet resistance of Ni suicide is originated from phase transition from NiSi to NiSi2 and/or agglomeration of the suicide layers. We noticed the phenomenon that the sheet resistance increased irregularly at the temperature region for the phase transition, that is,...
Silicidation process and effects of various kinds of additive metals for the improvement of thermal stability of Ni silicide were examined carefully for the 45 nm node. In order to obtain heat resistant NiSi, introduction of various metal layers introduced to top or bottom (interface of Ni/Si) of Ni on Si were investigated. However, we couldn't have any improvement in the thermal stability by any...
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