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Thermal shock test was performed on the SnAg3.8Cu0.7 (SAC387) solder bump interconnecting AlN and Cu substrate. Finite element modeling (FEM), cross-polarized light microscopy, scanning electronic microscopy (SEM) and EBSD were used to analyze the failure mechanism of them. It was realized that during thermal shock, the areas with higher stress would suffer from more serious IMC coarsening and then...
In this paper, a series of PCB strain-to-fatigue life characteristics were generated at a constant bending frequency of 100Hz for different material combinations: eutectic SnPb solder, SAC101 solder, and In/Ni-doped SAC101 solder, assembled on PCB with OSP and ENIG finish respectively. As expected, SAC101 solder exhibits similar performance as eutectic SnPb solder, and solder joints on OSP finish...
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