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The thermal design of a printed circuit board (PCB) requires a correct estimation of the temperature of each component that is part of it to guarantee the lifetime of the board. The literature presents different approaches for the prediction of the temperature distribution on the PCB, which considers both the contribution of the number and thickness of the copper layers and the quantity of current...
Joule heating of copper traces and vias in high current PCBs can significantly deteriorate the reliability of power electronics products. Optimization of the PCB layout is therefore fundamental to guarantee the thermal performance of a converter. This paper investigates the temperature distribution of copper traces and through via holes, when number and disposition of parallel vias are changed in...
In a typical raised floor data center, under floor plenum supplies cold air to the computer room via perforated floor tiles. Thermal management of any data center primarily depends on air flow rates through the tiles. These tile flow rates are a function of several factors that govern the flow pattern under the raised floor. CFD analyses of an ideal raised floor can often be misleading as they may...
Microprocessor driven escalation of thermal management needs has resulted in significant cooling challenges at the data center facility level, which can house thousands and tens of thousands of heat producing processors. Raised floor air ducting is the most common configuration, where chilled air from the air conditioning units is forced into the room via a under floor plenum and through perforated...
Microprocessor driven escalation of thermal management needs has resulted in significant cooling challenges at several different design levels, including the chip, package, module, board, and the rack, respectively, as well as for data centers in the case of servers. The spatial non-uniformity in the input power at the chip device or junction side, leads to the occurrence of hot spots that often represents...
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