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Interfacial reactions between Sn-9wt.%Zn solder and Cu substrates at 230°C were investigated. The substrate thickness was found to have noticeable effects on the evolution of the reaction products formed at the solder/Cu interface. The CuZn5 and Cu5Zn8 phases were formed at the early stage of reflow, regardless of the Cu thickness, while, with increasing reflow time, the two phases displayed different...
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