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In this paper, we present a novel micromachining approach for realizing 60 GHz foam aperture-coupled antennas. The foam is indeed an ideal antenna substrate provided by its electrical properties close to those of the air. At 60 GHz, the optimum foam thickness supporting the printed antenna must be about 400 um, which is a technological obstacle due to the poor mechanical resistance of the foam. It...
This paper presents a neural network-based technique for modeling and analyzing the electrical performance of flip-chip transitions. A lumped element model using a simple pi equivalent circuit is used to characterize the electrical properties of the flip-chip bond. Statistical experimental design is used to extract the electrical parameters for flip-chip characterization from measurements and full-wave...
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