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The 3D finite element analysis models of lead-free solder joint with compliant layer in wafer level chip scale package (WLCSP) were developed. Based on the models the lead-free solder joint with compliant layer stress and plastic strain were analyzed under thermal cycle. The results showed that: under thermal cycle loading conditions, the equivalent stress and equivalent plastic strain of the lead-free...
The 3D finite element analysis models of lead-free solder joint with compliant layer in wafer level chip scale package (WLCSP) were developed. Based on the models the lead-free solder joint with compliant layer stress and plastic strain were analyzed under thermal cycle. The results showed that: under thermal cycle loading conditions, the equivalent stress and equivalent plastic strain of the lead-free...
Non-linear finite element simulation by an elastic-viscoplastic constitutive model and the experimental characterization were carried out to investigate the volume effect of BGA structure solder joints under shear stress. A solder mask defined flat type copper pad of a circular opening 480 μm diameter and Sn3.0Ag0.5Cu (SAC) lead-free solder balls of 300–760 μm in diameter, were used to fabricate BGA...
The influences of the standoff height (H), contact angle (θ), pad size and loading rate on shear fracture behavior of BGA structure Cu/Sn-3.0Ag-0.5Cu/Cu joints were investigated by finite element (FE) method. The simulation results show that the maximum Von Mises stress zones locate on the edge of the solder near the intermetallic compound (IMC) layer in the BGA joint under shear stress, the cracks...
The interfacial micro structure and creep behavior of the single BGA structure Cu/Sn-3.0Ag-0.5Cu/Cu joint of different standoff height (i.e., solder volume) values and undergoing isothermal aging were studied by using the lap-shear test. The experimental results show that the thickness of the intermetallic compounds (IMC) layer at the solder/Cu interface increases with decreasing the standoff height...
Based on the current situation of poor vibration damping performance of conventional all-steel bogie wheel, a kind of segmented constrained layer damping structure is applied to bogie wheel to improve its vibration damping performance. This new structure mainly consists of a high-damping rubber layer as a viscoelastic material and the constraining layer segmented surrounding the rubber. A crawler...
Steel-Concrete-steel sandwich panel is a new tape composite plates, in which the two steel plates are inter-connected by a series of transverse bar connectors simultaneously friction welded at both ends or only one end, the load-bearing capacity and the rigidity of sandwich panel will be enhanced by using prestressed force. The interface slip of prestressed steel-concrete-steel sandwich panel appears...
A new type of six-axis full shearing strain force sensor has been developed. It uses strain gauge as sensing element for the detection of force. The elastic body is a thin cylinder on which four holes are opened evenly in two levels. There are six Wheatstone bridges on the beams to detect the force in six directions. The sensor was designed from the results of finite element method (FEM) simulation...
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