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Non-linear finite element simulation by an elastic-viscoplastic constitutive model and the experimental characterization were carried out to investigate the volume effect of BGA structure solder joints under shear stress. A solder mask defined flat type copper pad of a circular opening 480 μm diameter and Sn3.0Ag0.5Cu (SAC) lead-free solder balls of 300–760 μm in diameter, were used to fabricate BGA...
With the increasing miniaturization of electronic devices and products, the size of solder joints becomes smaller and smaller, the current density in the solder interconnects gets higher and higher, accordingly the electromigration (EM) has become a serious reliability issue for the solder interconnects. The studies on flip chip have shown that the configurable change of solder joints and current...
For micro-scale solder interconnects, the micro structure of the solder joint and the soldering defects are directly related to the solidification behavior of the undercooled solder. In this study, the undercooling and solidification behavior of Sn3.0Ag0.5Cu solder balls with different diameters (0.76, 0.50 and 0.30 mm) and the joints of soldering these balls on Cu pads of two different diameters...
In recent years, the Sn-Cu-Ni lead-free solders have attracted considerable attention from electronic packaging manufactures, due to the advantage of low cost. In this study, La-Ce mixed rare earth (MRE) with three different amounts of 0.05, 0.10 and 0.25 % (wt.%) was added into the Sn-0.7Cu-0.05Ni alloy to form the Sn-0.7Cu-0.05Ni-xMRE solder, and then, the interfacial reaction and microstructure...
The interfacial micro structure and creep behavior of the single BGA structure Cu/Sn-3.0Ag-0.5Cu/Cu joint of different standoff height (i.e., solder volume) values and undergoing isothermal aging were studied by using the lap-shear test. The experimental results show that the thickness of the intermetallic compounds (IMC) layer at the solder/Cu interface increases with decreasing the standoff height...
With the research on the emergency disposal, we build a new contingency scheme model based on the Petri net. The model can meet the needs of the emergency disposal of large ceremony. With this model, we can realize the automatic scheduling of the contingency scheme, control according to the feedback and help the commander to make the decision. It will make all people and departments work in harmony...
The interfacial reaction between pure Sn and different metallizations of Cu, Ag, Ni and Co, as well as the melting/solidification characteristics of each reaction system were investigated using a differential scanning calorimeter (DSC). Results show that there exists the early interfacial eutectic reaction in Sn/Cu and Sn/Ag systems, which leads to the occurrence of the Sn melting at the interface...
The influence of the standoff height, pad size and isothermal aging on the microstructure and shear fracture behavior of Cu/Sn-3.0Ag-0.5Cu/Cu BGA structured interconnects were investigated using the lap-shear test. The experimental results show that the thickness of intermetallic compounds (IMC) layer at the solder/Cu interface increases with decreasing standoff height of the joints. The size of Kirkendall...
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