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Due to the high integration on vertical stacked layers, power/ground network design becomes one of the critical challenges in 3D IC design. With the leakage-thermal dependency, the increasing on-chip temperature in 3D designs has serious impact on IR drop due to the increased wire resistance and increased leakage current. Power/ground (P/G) TSVs can help to relieve the IR drop violation by vertically...
Because of the strong non-linearity, uncertainty and typical underactuated properties, as well as the restraints of rudder, the design of ship tracking controller is yet a challenge work. In this paper, the problem was investigated by utilizing the active disturbance rejection control (ADRC) method. Firstly, the ADRC was introduced briefly and the characteristics of ship tracking motion were analyzed...
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