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This work studies the influence of temperature on performance and scalability of 3D Chip Multiprocessors (CMP) from Amdahl's law perspective. We find that 3D CMP may reach its thermal limit before reaching its maximum power. We show that a high level of parallelism may lead to high peak temperatures even in small scale 3D CMPs, thus limiting 3D CMP scalability and calling for different, in-memory...
GR712RC is a dual core 32-bit fault-tolerant SPARC™V8/LEON3-FT processor that has been developed and manufactured by Ramon Chip Ltd and AeroflexGaisler AB and characterized for radiation effects. It is designed with AeroflexGaisler's intellectual property and implemented with Ramon Chip's RadSafe™ radiation-hard-by-design library in a commercial 0.18µm shallow trench isolation CMOS process. Radiation...
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