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Light-emitting diodes (LEDs), representing a type of solid-state lighting, have been widely used as indicator lamps in the past few decades. It has attracted a great deal of attention in various illuminating applications in recent years due to its outstanding advantages, such as low power cost, long life time, and high efficiency. However, to make it possible to apply LED in daily life, a suitable...
In this study, a flexible wafer level packaging (FWLP) having the capability of redistributing the electrical circuit is proposed to resolve the problem of assembling a fine-pitched chip to a coarse-pitched substrate. In the FWLP, the diced chip is picked and back-sided attached to the flexible substrate after the functional testing. Besides, the solder on rubber (SOR) design is applied to expand...
The wafer level package (WLP) is a cost-effective solution for the electronic package, and has been increasingly applied during recent years. In this study, a new packaging technology developed based on the concepts of the WLP, the panel base package (PBP) technology, is proposed in order to further obtain the capability of signals fan-out for the fine-pitched integrated circuit (IC). In the PBP,...
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