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Package-process-oriented thick-Cu-wiring technologies have been developed for forming chip-level and package-level seamless interconnects between an LSI chip and the package substrate. Chip-level seamless interconnects are formed using a resin CMP process. Package-level seamless interconnects are formed by embedding a thinned chip into a resin on Cu base plate. A package with package-level seamless...
As a dismantle-able adhesion method using induction heating and thermoplastic adhesive, the allover method has been proposed for interior constructions. The method is able to bond and dismantle at many times. So we'd like to propose a unique detachable actuator which is able to attach and detach against any wall applied the allover method. In this paper, the structure of actuator and its behavior...
A method of chemical flip-chip bonding by electroless deposition process was proposed. This method positively utilizes preferential bridge deposition between metal pads in electroless Ni-B deposition and enables bump-less interconnect without loading and/or heating at lower temperature (60degC). Details of the deposition behavior for interconnection were investigated using fundamental test chips....
A chemical flip-chip bonding method by electroless plating process has been developed. This method positively utilizes so-called "bridge" phenomenon between metal pads in electroless Ni-B plating, and enables bump-less interconnect without loading and/or heating at lower temperature (60??C). The interconnect behavior was examined using test chips and substrates with various pad-to-pad configurations...
A preliminary investigation has been conducted to examine the applicability of the ultrasonic testing (UT) inspection technique for bonded structures in plasma facing components. In this study, existing UT probes have been used. Three test samples to simulate the blanket first-wall panel were fabricated. Artificial defects were applied along the diffusively bonded interfaces of the samples. Three...
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