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Warpage of micro-electronics caused by the curing process and thermal cycling is of major importance in electronic packaging. Industry is availed by good methods to be able to predict warpage accurately. The main difficulty for prediction of warpage is caused by the complicated material behavior of molding compound. It turns out that the mechanical behavior of molding compound is dependent on time,...
Generally, the viscoelastic properties of packaging materials used in the simulation models are obtained from the materials after postcuring. However these properties were observed to change during humidity conditioning and the thermal cycling. Two kinds of packaging materials are tested, one is molding compound and another is underfill. All samples are cured according to the curing procedure, postcured...
Underfill is a highly particle filled epoxy polymer used in flip chip to fill the gap between the leadframe and die or between die and die. In order to be able to flow in the thin gap, the silica filler particle must have a diameter below 10 mum. This epoxy underfill material mechanically couples the chip and substrate and decreases the stress in the solder joints, therefore enhancing solder fatigue...
Packaging failures has always been the bottleneck of the development on the new techniques of IC packaging using molding compounds. Numerous simulations are developed to minimize the maximum stress during or after the packaging process. Within those simulations, a reliable kinetic model is indispensable since the viscoelastic properties are related strongly with conversion during the cure process...
Four types of polymer which were selected are EPN1180 and EPN1180 filled with, 40%, 50%, and 65% fused silica. The moisture absorption is carried out in an adjustable thermal and humidity chamber at different temperature and humidity. The diffusion coefficients at different conditions were obtained through the early stage moisture absorption tests. The moisture absorption was revealed to show the...
Package warpage, interface delamination and thermal fatigue are the major reliability concerns for micro-electronic packages, caused by mismatch in thermal expansion together with residual stress originating from the curing process of the packaging polymers. To investigate the influence of the residual stress- and strain fields on the failure predictions and to optimise the product for reliability,...
We have investigated the behaviour of moisture absorption in various humidity environments at constant temperature of two types of epoxy novolac polymers. In addition, we examined the effects of moisture on the viscoelastic properties. The water absorption is carried out in an adjustable thermal and humidity chamber at different temperature and humidity. The diffusion coefficients at different conditions...
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