Search results for: Y.C. Chan
Journal of Electronic Materials > 2013 > 42 > 9 > 2835-2847
IEEE Transactions on Advanced Packaging > 2008 > 31 > 2 > 386 - 393
IEEE Transactions on Device and Materials Reliability > 2006 > 6 > 3 > 421 - 428
IEEE Transactions on Advanced Packaging > 2006 > 29 > 4 > 735 - 740