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Sn-8Zn-3Bi solder balls with different weight percentages of Sn-Ag-Cu addition were bonded to Au/Ni metallized Cu pads, and the effect of multiple reflow and aging on impact reliability was investigated. In the Sn-Ag-Cu content Sn-Zn-Bi solder joints, the AgZn3 intermetallic compound layer was clearly observed at the interfaces and its thickness increased with an increase the number of reflow cycles...
Ball shear test is the most common test method used to assess the reliability of bond strength for ball grid array (BGA) packages. In this work, a combined experimental and numerical study was carried out to realize of BGA solder interface strength. Solder mask defined bond pads on the BGA substrate were used for BGA ball bonding. Different bond pad metallizations and solder alloys were used. Solid...
Interfacial reaction and reliability related problems of the solder joint for both advanced electronic packaging applications and MEMS packaging applications are becoming crucial with the downscaling of the device size. In this study, the solid state interfacial reaction between the BGA Sn-3.5%Ag-0.5%Cu solder and the Au/Ni/Cu bond pad for MEMS applications was investigated at 150-200degC, for different...
The work presented in this paper focuses on the role of 3 wt% Bi in the base Sn-9%Zn solder on the shear strengths and the interfacial reactions with Au/Ni/Cu pad metallization in ball grid array (BGA) applications. Sn-Zn-Bi solders showed better results in terms of shear strength on liquid state annealing than Sn-Zn solders. Two failure modes, ball cut and interfacial intermetallics/pad separation...
A systematic experimental work has been carried out to investigate the effect of thicknesses of the Au and Ni layers in the bond pad metallization on the reliability of ball grid array (BGA) solder joints as well as to understand the mechanism of Au diffusion to the solder interface. BGA solder balls of Sn-37 wt.% Pb have been bonded on BGA solder bond pads of Au/electrolytic Ni/Cu by reflowing at...
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