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In order to identify the effect of the addition of Al and Ni nano-particles to Sn–Ag–Cu solder, the interfacial microstructure between the composite solders and Organic Solderability Preservative (OSP)-Cu pads has been investigated as a function of reaction time at various temperatures as well as aging time. Also the hardness of the solder joints was evaluated with the reaction time. In Sn-Ag-Cu-0...
Thermal analysis was used to clarify the growth mechanism of bulk Ag 3 Sn IMCs in Sn–Ag lead-free solders and compared with Pandat software calculations and theoretical calculations. In slowly-cooled Sn–Ag lead-free solders, bulk Ag 3 Sn IMCs formed when Ag 3 Sn crystal nuclei formed at the onset of the eutectic reaction. The fractions of bulk Ag 3 Sn IMCs in hypereutectic...
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