The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
We propose, for the first time, an explicit semiconductor physics-based through-silicon via (TSV) capacitance–voltage (CV) model. The effect of TSV CV hysteresis is demonstrated in the model, and the TSV capacitance is modeled with respect to dc bias voltage and the dimension of the TSV. The proposed model is verified by comparison to the measurement results. The effect of hysteresis in the model...
Through silicon via (TSV) has been extensively highlighted as the key solution for small form factor wide bandwidth, and low power consumption with compactly integrating multiple chips. Despite the many advantages of TSV based 3-dimensional integrated circuit (3D IC), there are several challenges to be overcome such as noise coupling, fabrication process limits, and failure issues. In this paper,...
Through silicon via (TSV) based 3D-IC is the key technology to satisfy the continuously growing demand on lower power consumption, higher system bandwidth and smaller form factor of electronic devices. As the I/O count increases up to the order of tens of thousands for high speed data transmission, TSV diameter and interconnection pitch are reduced, which may cause various defects throughout the channel...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.