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In this paper a measurement methodology, using a two-dimensional electron gas (2DEG) resistor, is used to evaluate the dispersion of three different type of buffers, namely a step graded buffer, a buffer with low temperature (LT) AlN interlayers and a superlattice buffer. Together with a dedicated Design of Experiments (DOE), these measurements allowed us to identify the physical origin of the dispersion...
Environmental Stress Screening (ESS) is usually referred to the process of exposing a product to environmental stresses for detecting and eliminating latent defects made in manufacturing process. The common ESS profiles are using thermal cycling, random vibration or their combinations as the screening stresses. Various guidelines and standards have been available for determining an ESS profile. Nevertheless,...
3D integration has the potential to alleviate the performance limitations that CMOS scaling is facing provided that it preserves the integrity of both front end and back end devices and constituting materials. The impact of wafer thinning and of the proximity of through silicon via on active devices, back end structures, ring oscillators and mixed signal circuit are reported for the first time for...
Because of its high thermal conductivity, great electrical property and low cost, copper wire is considered to replace the conventional gold wire and becomes widely used in IC assembly processes recent years. However, copper wire bonding also has its limitations. Copper oxidation, its high hardness and yield strength are two main disadvantages that manufacturers concern most. The application of copper...
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