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In this study, we demonstrate a novel imaging technique, based on ultra-small-angle X-ray scattering (USAXS) that uses a Laue-case Si wafer as the angle analyzer. Methods: We utilized the (1 1 1) diffraction plane of a 356 μm thick, symmetrically cut Si wafer as the angle analyzer, denoted by A[L]. With this device, we performed USAXS imaging experiments using 19.8 keV synchrotron X-rays. The objects...
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