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This paper reports on the systematic characterization and modeling of a CMOS-based sensor for high-pressure applications. The sensor consists of an anodically bonded silicon-glass stack comprising an n-type Wheatstone bridge as the piezoresistive stress-sensing element. Surface trenches introduced into the silicon close to the Wheatstone bridge significantly increase the pressure sensitivity of the...
This paper presents novel methods to fill complex micromold inserts for both positive and negative structures, i.e. high-aspect-ratio micropillar and deep slender cavities. Megasonic agitation is applied during polymer casting into the mold inserts. The replication is successfully demonstrated with hollow microneedle arrays. The mold inserts are fabricated using a combination of anisotropic wet etching...
Integrated circuits are often subjected to mechanical stress resulting from external loads or intrinsic stress caused by the mismatch in thermal expansion coefficients of the applied materials. Interconnects and vias in these circuits are particularly jeopardized when applied in complementary metal-oxide semiconductor (CMOS)-based microelectromechanical systems (MEMS). In this paper, we characterize...
This paper reports a CMOS-integrated three-axial force sensor system realized using a post-CMOS compatible low-temperature fabrication process which allows to process single IC dies as obtained from multi-project wafer (MPW) runs. The sensor system can be applied in coordinate measurement machines used for three-dimensional metrology of microcomponents. It is based on a flexible micromechanical cross...
This paper reports the successful fabrication and characterization of a novel three-axial silicon force sensor based on piezoresistive transducers and its application in dimensional metrology. The innovative sensor design enables a distinct reduction of the critical ratio Sz /Sx of out-of-plane stiffness Sz to in-plane stiffness Sx. In contrast to existing single-chip sensors with Sz/Sx = 30 a ratio...
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