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This paper reports on the systematic characterization and modeling of a CMOS-based sensor for high-pressure applications. The sensor consists of an anodically bonded silicon-glass stack comprising an n-type Wheatstone bridge as the piezoresistive stress-sensing element. Surface trenches introduced into the silicon close to the Wheatstone bridge significantly increase the pressure sensitivity of the...
A series of experiments has been conducted with probes made from silicon, glass, tungsten and polyimide within a developed brain phantom, and the insertion behavior, forces and dimpling are compared to in vitro and in vivo models. This allows the choice of proper insertion parameters and probe structure to reach a compromise between needle stability and tissue trauma as a result of insertion. According...
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