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This paper reports on the development and characterization of a CMOS-integrated three-dimensional force sensor for coordinate measurement applications. In contrast to previously presented tactile sensors using the same principle of operation, this sensor features 32 PMOS piezoresistive field effect transistors as stress sensing elements. We performed calibration measurements in the x, y, and z directions...
This paper reports a CMOS-integrated three-axial force sensor system realized using a post-CMOS compatible low-temperature fabrication process which allows to process single IC dies as obtained from multi-project wafer (MPW) runs. The sensor system can be applied in coordinate measurement machines used for three-dimensional metrology of microcomponents. It is based on a flexible micromechanical cross...
This paper reports a novel sensor concept to measure the six components of the forces and torques applied to smart orthodontic brackets. The concept is demonstrated using a packaged CMOS based sensor chip and a novel test setup to measure the six forces and moments applied to a smart bracket. By measuring the stresses in the plane of a sensor chip inside the bracket, it is possible to extract the...
This paper reports the successful fabrication and characterization of a novel three-axial silicon force sensor based on piezoresistive transducers and its application in dimensional metrology. The innovative sensor design enables a distinct reduction of the critical ratio Sz /Sx of out-of-plane stiffness Sz to in-plane stiffness Sx. In contrast to existing single-chip sensors with Sz/Sx = 30 a ratio...
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