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In this paper, a novel method of Cu-Cu bonding by using the Cu nanosolder paste was proposed. The pure Cu nanoparticles used for preparing the Cu nanosolder paste were synthesized with simple routes and relatively high yields. The Cu nanoparticles were homogeneously dispersed with an average size around 60 nm. The sintering and bonding performance of Cu nanosolder paste were investigated, while an...
In this paper, a novel Cu-Cu bonding method with Ag doped Cu nanosolder paste is proposed. The Cu nanoparticles were synthesized with an efficient method, and the nanosolder paste was fabricated by mixing synthesized Cu nanoparticles, commercial used Ag nanoparticles and organic solution. The shear strengths of Cu-Cu bonding with Ag doped Cu nanosolder paste and pure Cu nanosolder paste at the bonding...
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